LiPOLY’s BS series is an ultra-soft thermally conductive gel pad with high resilience characteristics which can avoid the deformation of PCB and other components caused by assembly stress. Thermal conductivity: 3.0~5.0W / m*K and hardness Shore OO/10-25 provide high flexibility, high compressibility, high insulation and good self-adhesiveness. It can cover the tolerance of design making it very stable, also can offer customized die-cut & shape molding service.